CHIP SCALE PACKAGE, CSP: Design, Materials, Processes, by John H. Lau,Ricky S.W. Lee

By John H. Lau,Ricky S.W. Lee

the 1st finished, in-depth advisor to chip scale packaging, this reference promises state of the art details at the most vital new improvement in digital packaging due to the fact floor mount know-how (SMT). that includes the newest layout strategies, plus info on greater than forty sorts of CSP, Chip Scale package deal palms engineers and architects the full, specialist set of operating instruments that they should resolve technical and layout concerns; locate the best, low-cost CSP options for his or her deployments; solution questions about interfacing, velocity, robustness, and extra; evaluate houses of wirebonds, turn chips, inflexible and flex substrates, wafer-level redistribution, and different CSP items; get the most recent info on new choices from Fujitsu, GE, Hitachi, IBM, Matushita, Motorola, nationwide Semiconductor, NEC, Sharp, Sony, Toshiba, Amkor, TT, LG Semicon, Mitsubishi, Shell Case, Tessera, Samsung, and different significant businesses; and know about CSP items less than improvement. A revolution in electronics, CSP is taking the electronics by way of typhoon. web page after web page, this standard-setting consultant offers either crucial technical information and an eye-opening assessment of this fast-developing box. irrespective of the way you use Chip Scale package deal, youÕll see why itÕs the source of selection should you are looking to be on the best of the game.

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