By Madhavan Swaminathan,Ki Jin Han
3D Integration is being touted because the subsequent semiconductor revolution. This e-book offers a accomplished assurance at the layout and modeling elements of 3D integration, in really, specialise in its electric habit. having a look from the viewpoint the Silicon through (TSV) and Glass through (TGV) expertise, the ebook introduces 3DICs and Interposers as a expertise, and provides its program in numerical modeling, sign integrity, strength integrity and thermal integrity. The authors underscored the potential for this expertise in layout trade codecs and gear distribution.
Contents:
- System Integration and Modeling Concepts
- Modeling of Cylindrical Interconnections
- Electrical Modeling of via Silicon Vias
- Electrical functionality and sign Integrity
- Power Distribution, go back course Discontinuities and Thermal Management
- Alternate equipment for strength Distribution
Readership: Graduate scholars, lecturers, researchers in electric and electronics engineering, desktop engineering, semiconductors and packaging.
Read or Download Design and Modeling for 3D ICs and Interposers: 2 (WSPC Series in Advanced Integration and Packaging) PDF
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